BiOcclus HT

Type 4
yellow / Au 85.4 
palladium-free, copper-free

Composition: Au 85.4 / Pt 12.0 / Zn 1.8 / Rh 0.4 / Fe 0.2 / Ir 0.1 / Nb 0.1
Standard: DIN EN ISO 22674 and DIN EN ISO 9693
Colour: yellow
Melting range °C: 1130 - 1055
Soft annealing: 15 mins at 950 °C / quench in water
Hardening: 15 mins at 500 °C 
Preheating temperature °C: 800
Casting temperature °C: 1280
Further heating after melting (secs): elektr.: 60
inductive: 5–10
flame: 5–10
Density g/cm3: 19.1
CTE 25°C-500°C (µm/mK): 14.5
CTE 25°C-600°C (µm/mK): 14.7
Soldering before firing: Orplid Keramik solder 1020
Soldering before firing: Orplid solder  760
Vickers hardness (HV 5/30): w: 100
a: 230
g/b: 175/220
0,2% proof stress (MPa): w: N/A
a: 530
g/b: N/A / 510
Elongation at break (%): w: N/A
a: 6
g/b: N/A / 13
Spruing: Following the rules for dental applications (see General Instructions for Use)
Investment: Phosphate-bonded investment materials
Preheating: 800 °C, 30 to 120 mins until end temperature, depending on size of mould
Casting: 1280 °C, possibly increase by 20°C–30°C for resistance-heated vacuum pressure casting. Graphite crucible or open flame with ceramic crucible
Finishing: With carbide burs and/or ceramic-bonded stones. Always grind in one direction only! Sandblasting at a flat angle, using 110 µm aluminium oxide. Pressure should not exceed 2 bar
Cleaning: ultrasonic cleaning or steaming with steam device
Oxide firing: 5 min at 900 °C without vacuum. It is imperative to remove the oxides. Preferably, acidify for 10 - 15 minutes in a warm and clean neacid bath or carefullyblast with 50 - 110 μm aluminium oxide. Finally, steam off thoroughly.
Soldering before firing: Orplid Ceramic solder 1020
Soldering after firing: Orplid solder 760
Firing: For normally expanding ceramic materials max. 955 °C*  *Temperature possible with optimal support or individual firing tray