| Composition: | Au 81.6 / Pt 16.0 / Zn 1.4 / In 0.5 / Nb 0.4 / Ir 0.1 |
| Standard: | DIN EN ISO 22674 |
| Colour: | yellow |
| Melting range °C: | 1160-1050 |
| Soft annealing: | 15 mins at 950 °C / quench in water |
| Hardening: | 15 mins at 500 °C / air |
| Preheating temperature °C: | 850 |
| Casting temperature °C: | 1310 |
| Further heating after melting (secs): | electr.: 60 inductive: 5–10 flame: 5–10 |
| Density g/cm3: | 19,0 |
| Solders: | Orplid Keramik solder 1020, Orplid solder 760 |
| Vickers hardness (HV 5/30): | w: 105 a: 220 g/b: 160/220 |
| 0.2% proof stress (MPa): | w: 225 a: 530 g/b: 390/530 |
| Elongation at break (%): | w: 20 a: 8 g/b: 10/9 |
| Spruing: | Following the rules for dental applications (see General Instructions for Use) |
| Investment: | Phosphate-bonded investment materials; gypsum-bonded investment materials |
| Preheating: | 850°C, 30 to 120 mins until end temperature, depending on size of mould |
| Casting: | 1310 °C, – possibly increase by 20°C–30°C for resistance-heated vacuum pressure casting. Graphite crucible or open flame with ceramic crucible. |
| Finishing: | With carbide burs and/or ceramic-bonded stones |
| Cleaning: | Ultrasonic cleaning or steam jet cleaning |
| Oxide firing: | 5 min at 900 °C without vacuum. It is imperative to remove the oxides. Preferably, acidify for 10 - 15 minutes in a warm and clean neacid bath or carefully blast with 50 - 110 μm aluminium oxide. Finally, steam off thoroughly. |
| Soldering before firing: | Orplid ® Keramik Solder 1020 |
| Soldering after firing: | Orplid solder 760 |
| Firing: | For normally expanding ceramic materials with a firing temperature of up to 950°C |