Orplid Implant

Type 4
white / Au 75.0 

Composition:Au 75.0 / Pd 19.0 / In 2.0 / Sn 2.0 / Cu 0.4 / Ag 1.0 / Ir 0.05 / Zn 0.5 / Ru 0.05
Standard:DIN EN ISO 22674 and DIN EN ISO 9693
Colour:white
Melting range °C:1230–1115
Soft annealing:15 mins at 800 °C / quench in water
Hardening:15 mins at 550 °C / air
Preheating temperature °C:850
Casting temperature °C:1380
Further heating after melting (secs): electr.: 90–120
inductive: 10–15
flame: 10–15
Density g/cm3:16.1
CTE 25°C–500°C (µm/mK):13.9
CTE 25°C–600°C (µm/mK):14.3
Soldering before firing:Orplid Ceramic solder 1020 / Orplid Ceramic solder 1070 (white)
Soldering after firing:Orplid solder 760
Vickers hardness (HV 5/30):w: 125
a: 240
g/b: 220
0.2% proof stress (MPa):w: 297
a: 605
g/b: 510/585
Elongation at break (%):w: 35
a: 14
g/b: 17/19
Spruing:Following the rules for dental applications (see General Instructions for Use)
Investment:Phosphate-bonded investment materials (Cehacast P or Cehacast Speed)
Preheating:850 °C, 30 to 120 mins until end temperature, depending on size of mould
Casting:1380 °C, possibly increase by 20°C–30°C for resistance-heated vacuum pressure casting. Graphite crucible or open flame with ceramic crucible
Finishing:With carbide burs and/or ceramic-bonded stones. Always grind in one direction only! Sandblasting at a flat angle, using 50–125 µm aluminium oxide. Pressure should not exceed 2 bar
Cleaning:Steam jet cleaning or boiling in distilled water
Oxide firing:5 mins at 950°C without vacuum. Afterwards, always clean in a preheated acid bath, e.g. Neacid, (for 10 mins) or sandblast with 50–125 µm aluminium oxide. Pressure should not exceed 2 bar. Clean thoroughly with a steam jet
Soldering before firing:Orplid Ceramic solder 1020 / Orplid Ceramic solder 1070 (white)
Soldering after firing: Orplid solder 760
Firing:For normally expanding ceramic materials (e.g. CeHa WHITE® Classic)
Firing temperature of the ceramic material: CeHa WHITE® CLASSIC: 20°C higher for opaquer firing
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