Orplid Keramik 21

Type 4**
yellow / Au 86.0
palladium-free, silver-free, copper-free

Composition:Au 86.0 / Pt 11.4 / In 0.9 / Rh 0.9 / Ta 0.4 / Mn 0.2 / Ir 0.1 / Ge 0.1
Standard:DIN EN ISO 22674 and DIN EN ISO 9693
Melting range °C:1130–1080
Soft annealing:15 mins at 700 °C/ quench in water
Hardening:15 mins at 500 °C/ air
Preheating temperature °C:850
Casting temperature °C:1280
Further heating after melting (secs): electr.: 60–90
inductive: 5–10
flame: 5–10
Density g/cm3:19.0
CTE 25°C–500°C (µm/mK):13.8
CTE 25°C–600°C (µm/mK):14.1
Soldering before firing:Orplid Ceramic solder 1020
Soldering after firing:Orplid solders 825, 735
Vickers hardness (HV 5/30):w: 100
a: 170
g/b: 130/150
0.2% proof stress (MPa):w: 200
a: 400
g/b: 280/340
Elongation at break (%):w: 23
a: 15
g/b: 16/17
Spruing:Following the rules for dental applications (see General Instructions for Use)
Investment:Phosphate-bonded investment materials (Cehacast P or Cehacast Speed)
Preheating:850 °C, 30 to 120 mins until end temperature, depending on size of mould
Casting:1280 °C, possibly increase by 20°C–30°C for resistance-heated vacuum pressure casting. Graphite crucible or open flame with ceramic crucible.
Finishing:With carbide burs and/or ceramic-bonded stones. Always grind in one direction only! Sandblasting at a flat angle, using 110–125 µm aluminium oxide. Pressure should not exceed 2 bar
Cleaning:Steam jet cleaning or boiling in distilled water
Oxide firing:5 mins at 900°C without vacuum
Soldering before firing:Orplid Ceramic solder 1020
Soldering after firing:Orplid solder 825; Orplid solder 735
Firing:For normally expanding ceramic materials (e.g. CeHa WHITE® Classic)
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