Orplid Keramik 4

Type 4
white / Au 74.5

Composition:Au 74.5 / Pt 10.2 / Pd 10.0 / In 2.9 / Ag 1.7 / Sn 0.5 / Cu 0.1 / Ir 0.1
Standard:DIN EN ISO 22674 + DIN EN ISO 9693
Colour:white
Melting range °C:1280–1130
Soft annealing:15 mins at 900 °C / quench in water
Hardening:15 mins at 600 °C / air
Preheating temperature °C:850
Casting temperature °C:1440
Further heating after melting (secs): elect.: 120–180
inductive: 5–10
flame: 5–10
Density g/cm3:17.8
CTE 25°C–500°C (µm/mK):14.3
CTE 25°C–600°C (µm/mK):14.5
Soldering before firing:Orplid Ceramic solder 1070 (white), Orplid Ceramic solder 1050 (yellow)
Soldering after firing:Orplid solders 760, 735
Vickers hardness (HV 5/30)w: 150
a: 260
g/b: 200
0.2% proof stress (MPa):w: 220
a: 535
g/b: 430/505
Elongation at break (%):w: 23
a: 5
g/b: 14/13
Spruing:Following the rules for dental applications (see General Instructions for Use)
Investment:Phosphate-bonded investment materials (Cehacast P or Cehacast Speed)
Preheating: 850 °C, 30 to 120 mins until end temperature, depending on size of mould
Casting:1440°C graphite crucible or open flame with ceramic crucible.
Finishing:With carbide burs and/or ceramic-bonded stones. Always grind in one direction only! Avoid using high speeds or applying heavy pressure (scale formation); sandblasting with 50–125 µm aluminium oxide. Pressure should not exceed 2 bar
Cleaning:Steam jet cleaning or boiling in distilled water
Oxide firing: 5 mins at 960°C without vacuum
Soldering before firing:Orplid Ceramic solder 1070 (white), Orplid Ceramic solder 1050 (yellow)
Soldering after firing:Orplid solders 760, 735
Firing:For normally expanding ceramic materials (e.g. CeHa WHITE® Classic)
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